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http://comimsa.repositorioinstitucional.mx/jspui/handle/1022/139| Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel | |
| HECTOR MANUEL HERNANDEZ GARCIA RITA MUÑOZ ARROYO JORGE LEOBARDO ACEVEDO DAVILA FELIPE DE JESUS GARCIA VAZQUEZ FELIPE ARTURO REYES VALDES | |
| Acceso Abierto | |
| Atribución-NoComercial-SinDerivadas | |
| Nanopartículas | |
| Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process. | |
| 2014 | |
| Artículo | |
| Inglés | |
| H.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262. | |
| TECNOLOGÍA METALÚRGICA | |
| Versión publicada | |
| publishedVersion - Versión publicada | |
| Aparece en las colecciones: | ARTÍCULOS/ CAPÍTULOS DE LIBRO / MEMORIAS DE CONGRESO |
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| Fichero | Descripción | Tamaño | Formato | |
|---|---|---|---|---|
| 2014_JMST.pdf | H.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262. | 1.59 MB | Adobe PDF | Visualizar/Abrir |