Please use this identifier to cite or link to this item: http://comimsa.repositorioinstitucional.mx/jspui/handle/1022/139
Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304 Stainless Steel
HECTOR MANUEL HERNANDEZ GARCIA
RITA MUÑOZ ARROYO
JORGE LEOBARDO ACEVEDO DAVILA
FELIPE DE JESUS GARCIA VAZQUEZ
FELIPE ARTURO REYES VALDES
Acceso Abierto
Atribución-NoComercial-SinDerivadas
Nanopartículas
Transient liquid phase (TLP) bonding of 304 stainless steel with nickel based filler metal, BNi-9, was performed to study the influence of silicon nanoparticles (NPs) on the mechanical and structural properties of the bonding area. It was found that silicon NPs act as a melting point depressant in the brazing process; the formation of silicon TLP induces the dissolution of elements of the metal filler and promotes a uniform distribution in the bonding area. Silicon NPs induce the development of smaller eutectic structures in the melting zone; it has been related to microhardness measurements, which are lower when the silicon NPs are used in the brazing process.
2014
Artículo
Inglés
H.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262.
TECNOLOGÍA METALÚRGICA
Versión publicada
publishedVersion - Versión publicada
Appears in Collections:ARTÍCULOS/ CAPÍTULOS DE LIBRO / MEMORIAS DE CONGRESO

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2014_JMST.pdfH.M. Hdz-García, A.I. Martinez, R. Muñoz-Arroyo, J.L. Acevedo-Dávila, F. García-Vázquez, F.A. Reyes-Valdes. (2014) Effects of Silicon Nanoparticles on the Transient Liquid Phase Bonding of 304Stainless Steel. Elsevier. J. Mater. Sci. Technol., 2014, 30(3), 259e262.1.59 MBAdobe PDFView/Open